The world is reeling towards AI/ML newer planes, and our EDA world is adding these technologies into their tools and rising to the occasion. This has created a lot of additional opportunities within the semiconductor industry in terms of newer technologies, employment, and training. But we are still witnessing a global crisis of skill gap in the semiconductor industry, which is seen as a challenge when hiring graduates mostly from electronics/computer science backgrounds into our industries, wherein the students are just not ready enough knowledge-wise nor skilled practically to contribute efficiently towards a hungry-for-good-engineers arena of the IC world.
We are witnessing attempts mushrooming globally in the form of collaborations between Industries and universities to chalk out programs to address this challenge at its root, which is, just before the Engineers graduate, as a finishing program attached to their regular engineering degree curricula - Bachelor's or Master's programs.
Cadence Customer Training Team has been involved in such programs rigorously and passionately for the past couple of years and has successfully developed content that would help these skill-gap collaborations. In this direction, the Cadence Training team has created an excellent tool-agnostic basic course, Digital IC Design Fundamentals (DICDF), which thoroughly explains the basics of the entire IC design flow, from design conception till GDSII and IC Packaging phases. It takes one through the practical aspects of why and how we are using the concepts that the students learn in their university curriculum and how these are applied and matter in the industry applications.
The DICDF course begins by describing the challenges in the semiconductor industry on the design, verification, and implementation fronts. It then focuses on the different kinds of opportunities in the VLSI industry, which are in the design, verification, and Implementation domains, thus touching upon the front-end and back-end divisions in the industry.
The course continues towards the exploration of the concepts of design specification, IC hardware, functional design challenges, SystemVerilog for design and verification, simulation concepts, low-power aspects, functional verification concepts, generic debug techniques, formal verification, methodologies like metric-driven verification (MDV) and UVM, etc. It is then followed by the detailed back-end concepts of synthesis, digital implementation topics, floor planning, place and route, timing analysis, logical equivalence checking, etc., leading to the GDSII phase. It finally describes the IC board design and packaging concepts.
This course is suitable for new joiners in the industry and university programs alike for introducing the semiconductor flow conceptually in a compact manner.
Digital IC Design Fundamentals
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